Hi-Abuse XP Gypsum Board GridMarX Gypsum Board Customer Service & Product Availability Information Fire & Sound Assemblies Code Reports Case Studies DIY Information Submittal Certificate General Terms and Conditions of Sales

NGC Home  ->  Gold Bond, ProForm, XP Gypsum Board, PermaBase Products and More  ->  Hi-Abuse XP Gypsum Board  09 29 00   This page gives details about products. Download product related information or search again. Hi-Abuse XP Gypsum Board > CSI 3 Part Specifications Word (165 Kb) PDF (67 Kb) > Guidespec Word (36 Kb) PDF (36 Kb) > MSDS PDF (76 Kb) > Submittal PDF (263 Kb) > Product Literature PDF (1015 Kb) Description Hi-Abuse® BRAND XP® Gypsum Board panels consist of a tapered edge, fire resistant, Type X gypsum core encased in heavy, smooth, abrasion resistant, mold/mildew resistant, 100% recycled purple paper on the face side and 100% recycled heavy mold/mildew resistant paper on the back side. Hi-Abuse XP Gypsum Board is designed to provide extra protection against mold and mildew compared to standard gypsum board products. The panels feature a specially formulated core to provide greater resistance to surface indentation and abuse. Tapered edges allow joints to be reinforced with ProForm® BRAND Joint Tape and concealed with ProForm® BRAND Ready Mix or setting compounds. Applications This unique gypsum board is designed for use in wall assemblies in areas where surface durability, indentation and mold/mildew resistance are major concerns. 5/8" Fire-Shield Hi-Abuse XP Gypsum Board may be used where Type X gypsum panels are specified in some fire-rated wall and floor-ceiling assemblies (e.g., UL U300, U400, V400 and L500 series). Features & Benefits Provides greater resistance to surface abuse and indentation over standard gypsum board. Hi-Abuse XP features a smooth, heavy, robust face paper that is highly resistant to scuffing and provides a superior surface for decoration. Hi-Abuse XP Gypsum Board is easily scored and snapped for quick installation. Openings and outlet boxes are cut out in same manner as standard gypsum board. Lightweight, cost-efficient material that readily accepts a wide range of decorative finishes. The gypsum core will not support combustion or transmit temperatures greatly in excess of 212°F (100°C) until completely calcined, a slow process. Expansion and contraction under normal atmospheric changes are negligible. Resists the growth of mold per ASTM D 3273. Does not require the added strength of a setting type compound for joint reinforcement. Allows for same joint treatment reinforcement procedures as standard drywall, thereby reducing cost and the risk of improper installation. Transitions into drywall without the use of control joints. Saves time by eliminating the need for special cutting tools and rasping of cut edges. Hi-Abuse XP Gypsum Board can be used as a tile backer board in dry areas only. Mold and Mildew Resistance* Hi-Abuse® BRAND XP® Gypsum Board has been designed to provide extra protection against mold and mildew compared to standard gypsum board products. When tested by an independent lab per ASTM D3273 ("Standard Test Method for Resistance to Growth of Mold on the Surface of Interior Coatings in an Environmental Chamber"), Hi-Abuse BRAND XP Gypsum Board achieved a score of 10, the best possible score for this test. *The use of Hi-Abuse XP Gypsum Board in actual installations may not produce the same results as were achieved in controlled, laboratory conditions. No material can be considered "mold-proof", nor is it certain that any material will resist mold or mildew indefinitely. When used in conjunction with good design, handling and construction practices, Hi-Abuse XP Gypsum Board can provide increased mold resistance versus standard gypsum board products. As with any building material, avoiding water exposure during handling, storage and installation, and after installation is complete, is the best way to avoid the formation of mold or mildew. Enter a search term and press Return or click the Search button. © National Gypsum Properties, LLC 2001 - 2008 | Privacy Statement

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